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TF Deck
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Shenzhen Xin Nan Tian Technology Co., Ltd.

Address: Building 5, Zhengzhong Industrial Park, Dayangtian, Fuyong Town, Bao'an District, Shenzhen, China

Tel: 0755-29851556  

Fax: 0755-29851539

E-mail:linxinxiang@126.com

Website: www.dgsmzh.com



昆山TF card holder SD PUSH 2.75mm high solderband detection

  • category:昆山SD Series

  • The number of clicks:
  • Release date:2018/06/22
  • Inquiry
details
Product ID:
SD-001-001
product name:
SD PUSH 2.75mm high solder fillet detection
specification:
Plastic: Black high temperature UL94V-0; Terminal: Copper alloy housing: Stainless steel
Product Note:
Push push type with CD terminal, SMT type L28.80*W28.45*H2.75
Product Category:
microSD TF SD Series


Specifications: 

1. Rated current: 0.5mA AC/DC  
2. Rated voltage: 125V AC/DC 
3. Operating temperature: -25°C ~ +60°C 
4. Storage temperature: -40°C ~ +70°C 
5. Contact resistance: 100m ohms max. 
6. Insulation resistance: 1000M ohms min./500VDC 
7. Durability: 10000 times 
8. Product temperature resistance: 260±5°C 10S 
9. RoHS compliant 
Note: 
1. This connector is widely used in mobile phones and flat panels. Computers, navigators, LCD TVs, etc.; 
2. Inspection process for secondary products: IQC feed inspection -> storage -> pre-line self-test -> IPQC inspection -> FQC final inspection -> OQC out of the goods Inspection 
3. This product production process is: pre-line inspection -> group terminal -> assembly slider, tie rod, spring -> assembled shell -> push inspection -> electrical inspection -> flatness test - -> Appearance Inspection -> FQC Inspection -> Storage



SD-001-001.pdf


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